Enquiry





I authorize Digisol to contact me. This will override registry on the NDNC.

captcha

Going Solderless: Here’s everything you should know about the Press Fit Technology

Going Solderless: Here’s everything you should know about the Press Fit Technology

The Internet is an ever-growing phenomenon; its advancement has not only changed the way people function throughout their daily lives but has brought endless opportunities for businesses. Another such phenomenon is Power of Ethernet (PoE). Today, majority of infrastructure uses PoE applications as it not only enables data transmission but also power transmission over the same network cable, it indeed brings great convenience to both residential and commercial users. We all know that solder flux is used to fix the components on the PCB of the PoE device. When electrical power flows through LAN connections it generates heat and over time it leads to melting of solder flux in the structured cabling components like patch panels and keystones. This eventually hampers the efficiency of PoE applications before time and reduces the longevity of the product. PoE applications’ efficiency decreases due to corroded connections which further prove to be fatal in terms of IT infrastructure costs as well as IT networking experience for all concerned at the site.

Downtime caused by network problems has a major impact in sectors like banking, healthcare, education, and manufacturing. However, we at Digisol have a savoir for you that will tackle these network problems and its called Press Fit technology that does away with the need for solder flux.

What is Press Fit Technology?

Press-Fit is a solder free electrical assembly process that uses a tight fit and high-pressure mechanism where the terminals of a press-fit connector are inserted into plated-through holes in the printed circuit board, with the induced pressure it creates contact between the holes and the terminals to pass electric current.

Press fit pinions are also known as interference fit, the plated-through holes either be the exact size of the shaft or usually slightly undersized, when the two are pressed together, a tension is created which results in super high fiction that allows force to be transferred through the assembly with essentially no loss or slippage as the friction force is greater than the rotary force being generated in the process.

Press-fit connectors are now popularly used in many applications like data and communication to transportation and mechanics and also hospital equipment. Press-fit pin is inserted in a complaint section which is slightly bigger than the PCB hole. Once the pin is inserted the complaint section gets compressed this is known as a Press-Fit Connection. The compliant section dynamically adjusts to a controlled variance in hole sizes.

A Compliant Pin is formed by using a flat sheet copper metal stamping and coining process. This process includes a precision punch and die tooling set. A Press fit Compliant Pin section is designed primarily to compress with a dynamic coefficient during press insertion into the circuit board. It is important to note that to adapt to a given finished hole diameter range as specified by the connector manufacturer. The Compliant Pin interference will create a gas tight mechanical interconnection to the PCB PTH thus providing a proven, dependable and reliable interface.

Solderless Press-Fit in enterprise infrastructureAdvantages Solderless Press-Fit in enterprise infrastructure

  • Chemical-free process allows press-fit to boasts strong environmental credentials.
  • Side-effects associated with solder vapour and welding flux residues are eliminated
  • Connector pins can be easily replaced
  • Low heat dissipation and thermal stress due to lower resistance
  • Reduces soldering defects like bridges, bad wetting and flux residuals
  • It has the capacity handle high range of temperature from 125ºC to 150ºC and above with high current carrying capacity
  • Provides robust and reliable system performance which enables for a faster and more efficient manufacturing process

 

With Increasing demand for PoE applications and solder-free technology there is a need for products that are robust against oxidation and help in maintaining the efficiency of PoE Applications. DIGISOL recently launched its Solder-free Patch Panel and Keystones under it’s ConvergeX product series. Enclosed below please find the product details:

Product Links: https://localhost/all-written/convergex-scs/

Share this post

WhatsApp chat